01/06/2010 05:01:00

Ralink Enters DSL Market with Complete Integrated Access Device (IAD) Designs that Include ADSL2+, 802.11n Wireless and Carrier

Ralink Technology, Inc. (TAIEX:3534) (Ralink), a leading developer of

high performance wired and wireless networking solutions, today

announced its two next generation xDSL2+ 11n Wi-Fi IAD (Integrated

Access Device) solutions known as the TC3182P2V + and TC3182LEV.

Designed as an all-in-one solution for service providers looking to

provision rapidly growing markets around the globe, the TC3182x series

offers the greatest cost to performance ratio yet seen in the market.

The TC3182x series also includes a telco-class 10/100 Fast Ethernet

switch, and telecommunication standards-compliant software, all on an

industry-leading two-layer printed circuit board, offering the

industry's best price-performance “turnkey” solution.

“We are extremely pleased to see the results of Ralink’s merger with

Trendchip come to fruition,” said Boming Wang, General Manager of

Ralink’s Broadband Business Unit. “The added depth and breadth to our

product line will allow Ralink’s entry to any number of emerging markets

and allow us to compete for cross-platform deals with any networking

chip manufacturer in the world.”

The next generation ADSL2+ and 802.11n CPE solution, which is applicable

for ADSL single-port 1T1R/2T2R and four-port 1T1R/2T2R 802.11n Wi-Fi

gateways, also supports a variety of peripherals via USB2.0 host

interface to meet customer demand for digital home peripherals and

applications such as connecting media server disk drives and optional 3G

connections.

Primary features for the TC3182x platform include:

  • State-of-the-Art ADSL2+ chipset with PCIe interface for connections to

    Wi-Fi PCIe clients ranging from low-cost 150Mpbs 1x1 2.4GHz 802.11n

    all the way up to industry-leading 450Mbps 3x3 dual-band 802.11n

  • Cost competitive 2-layer PCB reference design

  • 30% reduction in PCB size compared to competitor’s solutions

  • Competitive memory footprint using Ralink’s LiNOS operating system

    which has been optimized for “triple play” wireless-enabled Gateway

    and IAD applications

  • Multi-threaded MIPS34Kc embedded processor for optimal VoIP and IPTV

    services support

  • Flexible IAD platform to fulfill Telco requirements and applications

  • Integrated support for a range of voice codec solutions

“The emerging markets of China, Eastern Europe and Latin American

require low cost, high performance, tightly integrated products with

multiple on-board interface tie-ins for 3G, USB dongles and other

accessories,” said Jagdish Rebello PhD, Senior Director and Principal

Analyst of market research organization iSuppli Corp. “Successful

players in this arena will be able to ride the massive adoption curve of

the burgeoning markets and the accompanying volume increases derived

from multi-platform cross-selling. Ralink seems to be targeting this

market with the TC3182x integrated Home Gateway solution.”

About Ralink Technology

Ralink Technology Corporation is a leading innovator and developer of

wireless and wired chipset solutions. The company’s products are

recognized for their superior throughput, extended range, low-power

consumption, and consistent reliability. Ralink’s range of patented

technologies extend Wi-Fi and wireline applications from traditional PC

networking to a variety of digital multimedia and handheld devices

including cell phones, PDAs, cameras, print servers, HDTV, gaming

devices and set-top boxes. Ralink Technology was founded in 2001 with

headquarters in Hsinchu, Taiwan and an advanced R&D center in Cupertino,

California. For more information about Ralink please visit www.ralinktech.com

Ralink, Ralink Technology and MIMObilityTM are Ralink’s

registered trademarks; All other trademarks mentioned in this document

are the property of their respective owners.

Ralink Technology, Inc.

Joe Volat, 408-725-8070

jvolat@ralinktech.com

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